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How to solve the FSC board warpage problem?

by:NEW BAMBOO PAPER     2020-11-20
As is known to all, paper board warpage is all packaging plant as well as the main obstacle to cardboard processing plants, it is to produce various ills, such as adhesion rate is reduced, and gum paste, artificial increase many problems, such as partners, and it will directly affect the product key factors of forming, bad product will increase because of this, production process and brings. We mainly explain the main factors of cardboard warpage, because the water content of the cardboard is uneven, the moisture content exceeds bid, the following paper to produce smooth, hard degree of the cardboard, must pay attention to control the water content of products at the same time in the production and the method of glue.
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